Compact, Clever, Simple & Agile

Smart-Sized Modular

Compact, Clever, Simple & Agile

smart-sized modular

Introducing - The Fox Pack - State of the art technology. Expandable in any direction. The Fox can drive up to 200 feeder, illustrating its dedication to high-mix production. Due to its small footprint and reasonable weight, the machine is ideal for use in limited space production areas even those located on upper floors.

    Fox4 Fox2 Fox
Productivity Optimum placement speed 18’800 cph (4-axes) 12’000 cph (2-axes) 7’000 cph (1-axis)
  Optimum jetting speed - 150‘000 Dots/h -
Feeder Feeder Capacity 8 mm Tape 200 (140 inline) 180 (120 inline) 180 (120 inline)
Components Component Size Range   01005 - 33 x 33 mm (optional up to 80 x 80 mm)
Accuracy Placement accuracy (x, y)   50 μm @ 3σ  
PCB Max. PCB dimensions   406 x 305 mm (16 x 12“)  
Dimensions Machine footprint   880 x 1090 mm (34.7 x 43“)  

Multitalent Software
at your Fingertips

State of the art, full graphics,  21.5”, 16:9 HD wide touch screen, fingertip operation, universal CAD conversion,
zoom at camera windows, all-in-one job planning, setup optimisation, stock management, ERP/MES connection,
data analysis, line management and more.

Review from BRAUN GmbH

It was necessary to develop a new production strategy. The aim was to minimize downtimes in the entire production chain, taking into account a minimum number of employees in production. The aim was to master the complex production requirements with minimal effort on the line and thus reduce production costs.

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Review from E-REON BV

Many of their clients are world-renowned companies who rely on E-REON to help them further innovation in this market segment. The company just invested, for the first time, in a rapid prototype centreincorporating Essemtec Fox MFC equipment.

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    Piezo Jet Dynamic Shockwave   Volume Screw Time-Pressure
    SMD-Adhesives, Underfill,
Silver Epoxy, UV-Adhesives,
Globe Top, Encapsulation,
Solder Paste
Solder Paste,
  Underfill, Gasketing,
Globe Top, Dam and Fill,
Solder Paste
Solder Paste, SMD-Adhesive,
Globe Top, Encapsulation,
Silver Epoxy, Dam and Fill
Gasketing, Globe Top,
Encapsulation, Solder Paste,
SMD-Adhesive, Silver Epoxy,
Dam and Fill
    Low - High Viscosity High Viscosity   Low - High Viscosity High Viscosity High Viscosity
    Up to 150.000 dots/h Up to 80.000 dots/h   Up to 28.000 dots/h Up to 20.000 dots/h Up to 28.000 dots/h


Optional Equipment
For our Pick-and-Place

Since 1991, we have been evaluating and developing solutions for your electronics production in cooperation with you.
Due to their highly flexible design, the modular machine platforms are ideally suited for RFNS (Request For Non-Standard).
Our engineers assist you in the development of your production process, on request.

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Naturally adaptive

Configurable heads with 1-4 placement-axis. 2,5D and 3D dispensing and jetting, High resolution digital vision system with auto component teach-in and irregular ball recognition. Full operator support - Automated error analysis & KPI. Training, support and troubleshooting via advanced remote access. Investment protection; all options and heads retrofittable. Multi flexible feeder, multi lane cassette or highly accurate single lane feeder. Tape, Stick, Strip, Tray slider. Largest component spectrum; 01005 up to 80 x 80 mm, height up to 25 mm.