smart-sized high
speed dispenser
Introducing - The Spider - State of the art technology, easily integrated in any line. Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.
dispense technology
Up to 2 valves simultaneously
5 different valves, large application range
productivity
Up to 150’000 dots/h (with Piezo Jet Valve)
Up to 2’000’000 dot/h line mode
small footprint
Requires only 1 m² of production floor
Machine fits through 90 cm wide door
mineral cast
No vibration, symmetrical mineral casting
No warpage, no thermal drift
height mapping
Mapping of heights using laser technology
Compensation of substrate warp / 3D contour
linear motors
Fast, reliable double drive linear motors
No maintenance, longest lifetime
| Spider | ||
|---|---|---|
| Process | Maximum dispensing speed | Piezo Jet Valve: 150‘000 dots/h |
| Pneumatic Jet Valve: 80‘000 Dots/h | ||
| Time/Pressure Valve: 28‘000 Dots/h | ||
| Archimedean Screw Valve: 24‘000 Dots/h | ||
| Dispensing mode | Dot, line, curve, interpolated 3D contour | |
| Accuracy | Placement XY dots | 40 μm (3σ) |
| Positioning Z axis | 20 μm (3σ) | |
| PCB | PCB dimensions | 50 x 50 mm bis zu 406 x 305 mm (2 x 2” up to 16 x 12”) |
| Dimensions | Machine footprint | 880 x 1090 mm (34.7 x 43”) |
Multitalent Software
at your Fingertips
State of the art, full graphics, 21.5”, 16:9 HD wide touch screen, fingertip operation, universal CAD conversion,
zoom at camera windows, all-in-one job planning, setup optimisation, stock management, ERP/MES connection,
data analysis, line management and more.
| Time-Pressure | Volume | Screw | Piezo Jet | Pneumatic Jet | |||
|---|---|---|---|---|---|---|---|
|
Gasketing, Globe Top, Encapsulation, Solder Paste, SMD-Adhesive, Silver Epoxy, Dam and Fill |
Underfill, Gasketing, Globe Top, Dam and Fill, Solder Paste |
Solder Paste, SMD-Adhesive, Globe Top, Encapsulation, Silver Epoxy, Dam and Fill |
SMD-Adhesives, Underfill, Silver Epoxy, UV-Adhesives, Globe Top, Encapsulation, Solder Paste |
Solder Paste, Dam and Fill, SMD-Adhesives | |||
| High Viscosity | Low - High Viscosity | High Viscosity | Low - High Viscosity | Low - High Viscosity | |||
| Up to 28.000 dots/h | Up to 28.000 dots/h | Up to 20.000 dots/h | Up to 150.000 dots/h | Up to 80.000 dots/h |
Naturally adaptive
Integrate into high speed lines and highly complex dispense applications. Two processes at the same time. Plug and Play for valve change. Piezo Jet Valve - super high speed for low viscosity. Solder Jet, Volume Displacement, Time/Pressure, Archimedean Screw Valve. Full operator support - Automated error analysis & KPI. Training, support and troubleshooting via advanced remote access. Investment protection; all options and heads retrofittable.