Jet Printing, Glue Jetting and Pick&Place

Unique Solution for
Electronic Production

Jet Printing, Glue Jetting and Pick&Place

SOLDER PASTE JET Printing, Glue Jetting and Pick&Place on a single platform

The Archerfish with its „scientific“ abilities, speed, precision and cleverness inspired us to develop our solder paste jet printing solution. The Archerfish waylays for its prey in the salty brackish water of the mangrove forests. Just below the water surface, it observes its prey, calculates the refraction of the water jet, calculates the distance and the environment of its target and fires a targeted water jet at its victim. Precise, fast, just like the Archerfish!

Solder Paste Jet Valve
Viscosity range < 2’000’000 mPa*s
Min. possible dot diameter/ volume > 200 μm / > 2.5 nl
Optimum Speed Up to 80’000 dph
Useable applications Solder Paste in electronics, also for cavities
Useable solder pastes Type 4-7 (jettable), recommended pastes: Indium, WinDot
Valve heater Included, max. 60°C
Useable cartridge sizes 5 ccm / 10 ccm / 30 ccm


EXPANSION IN ANY DIRECTION

PCB design freedom

Real time visualisation

FROM NPI TO MID RANGE,
UP TO INTEGRATION IN HIGH SPEED LINES

This Non-contact jet printing valve has been developed to jet solder pastes from class 4 to 7, jettable types only.
Integrated and combined with a Pick-and-Place process in one of Essemtec's platforms it opens the possibility of an
"All-In­-One" production, enabling customers full flexibility to process complete PCB's within only one machine.

Time to market -
No Printer, No Stencils

Freely selectable and combinable settings of jet parameters for optimal adaptation to customer requirements and characteristics of the dispensing material.
The dynamic shockwave technology allows to jet several hundred shots within just a second and with high accuracy and repeatability.

Contact our Sales or Service Team for more information