For over 30 years, efficiency, technology and quality have been continuously promoted, especially in SMT production. However, new technical developments of modern assemblies led to new requirements for a combined gluing and soldering process in the SMD assembly. The aim is to reduce manufacturing costs through improved automation and ensure the high quality standards.
Industry 4.0 increasingly encourages the remote observation and inspection of systems. Hekatron assembles its products exclusively in Germany. They currently use Essemtec “Spider” & "Tarantula" dispensers to conduct the dispensing applications for their SMD large-scale production in Sulzburg.