SMART AND
HIGHLY Flexible
smt solutions

Wildlife consistently shows us with breathtaking flexibility how nature can adapt itself to the many different demands of its environment; that is what inspires us! Essemtec AG is a company with its development and production site in Switzerland. The product portfolio comprises of production equipment for electronic assembly and more. Our high tech solutions can be adjusted quickly and easily to meet wide ranging requirements; we are therefore able to respond to all manner of customer requests.

News

Interview with Pirmin Fischer: Teamleader Customer Service & Project Management

Essemtec has implemented a project management framework to ensure smooth and efficient machine installations. Essentially, Pirmin serves as the single…

CUONICS and Essemtec: A Collaborative Journey Toward Excellence in Aviation Electronics

The ability to combine placement and dispensing in a single machine introduced new efficiencies in our production processes...

BeFC and ESSEMTEC AG: Pioneers of the New Generation of Sustainable Microelectronics with Bio-Enzymatic Fuel Cells

BeFC was seeking an ultra-flexible process solution that combined the dispensing of conductive and structural adhesives, the placement of SMD…

TEA ELETTRONICA - APPLIED ELECTRONIC TECHNOLOGIES - A Quality Leap with Essemtec's FOX4 Pick and Place

TEA Elettronica is a company specialized in the design and production of electronic boards. With over 30 years of experience in the industry...

Enhancing Nexperia’s Production Capabilities with the Essemtec Fox All-in-One

Its integrated concept allows for dispensing epoxy and solder paste, providing Nexperia with unmatched versatility and ensuring its production…

Innovation

Unlock the Future of SMT with Essemtec's Latest Upgrade: PCIe5 Controller and .NET Core Architecture

Essemtec's commitment to continuous improvement means that every upgrade enhances the value of your equipment...

Essemtec Wins 2024 Mexico Technology Award for Excellence in Dispensing Technology

Recent upgrades to the Spider enable solder paste jetting to achieve an average of 260,000 dots per hour on a board, a 45% improvement compared to the…

Introducing "Essemtec TechTalk: Engineering SMT Solutions"

In the first episode, we’ll discuss the development of our latest dispensing solution, Jet-on-the-Fly for High-Speed Solder Paste Jetting by Irving…

Enabling re-use of expensive BGA components with fast & high quality of BGA re-balling process is a highly cost-effective process

Reballing BGAs contributes to sustainability by extending the lifecycle of electronic components. By reusing components, the demand...

Essemtec`s Latest Animal: Tarantula Underfill

An Innovative Solution to perform underfill process accurately, precisely & efficiently...

Events

Essemtec to Showcase High-Speed Dispensing and SMT Solutions at Nepcon Shenzhen 2024

Discover Essemtec`s SMT Equipment - Pick and Place & Dispensing with Integrated Inspection System...

Electronica München 2024

Meet Essemtec and Nano Dimension in Booth B1.115 at electronica, Munich, November 12. - 15., 2024

Discover Essemtec’s All-in-One Concept for Rapid-Prototyping at Electronica 2024...

Essemtec invites you to TEK Day Poland I Amber Expo Gdańsk I 26. Sept 2024 I booth 87

Discover Essemtec`s SMT Equipment - Pick and Place & Dispensing with Integrated Inspection System...

Essemtec invites you to SMTA International I Rosemont, IL USA I 22.-24. Oct 2024 I booth 2841

Discover Essemtec`s SMT Equipment - Pick and Place & Dispensing with Integrated Inspection System...

Essemtec and SMD-TEC invite you to WoTS – World of Industry, Technology & Science I Jaarbeurs Utrecht, NL I Booth 9A092

Discover Essemtec`s SMT Equipment - Pick and Place & Dispensing with Integrated Inspection System...