SMART AND
HIGHLY Flexible
smt solutions

Wildlife consistently shows us with breathtaking flexibility how nature can adapt itself to the many different demands of its environment; that is what inspires us! Essemtec AG is a company with its development and production site in Switzerland. The product portfolio comprises of production equipment for electronic assembly and more. Our high tech solutions can be adjusted quickly and easily to meet wide ranging requirements; we are therefore able to respond to all manner of customer requests.

News

Enhancing Nexperia’s Production Capabilities with the Essemtec Fox All-in-One

Its integrated concept allows for dispensing epoxy and solder paste, providing Nexperia with unmatched versatility and ensuring its production…

Essemtec Announces the Opening of New Demo Center in Newton, Massachusetts

We invite our customers to visit and explore how our technology can meet their specific needs...

How Mostec AG move to 100% High-Speed Solder Paste Jet Printing in its SMD Line

For over 40 years, MOSTEC AG has been engaged in the development of electronics for measurement and control systems. Electronics development is our…

SF-SMT Showcases Essemtec’s Advanced SMT Solutions at Elexcon 2024

SF-SMT's participation at Elexcon underscores the growing demand for advanced SMT solutions in the Chinese market...

Meet David Plass, Product Specialist for Dispensing: Sustainability in Action

Discover how Essemtec is advancing sustainability in the industry through innovative dispensing technologies and a machine upgrade philosophy...

Innovation

Essemtec Wins 2024 Mexico Technology Award for Excellence in Dispensing Technology

Recent upgrades to the Spider enable solder paste jetting to achieve an average of 260,000 dots per hour on a board, a 45% improvement compared to the…

Introducing "Essemtec TechTalk: Engineering SMT Solutions"

In the first episode, we’ll discuss the development of our latest dispensing solution, Jet-on-the-Fly for High-Speed Solder Paste Jetting by Irving…

Enabling re-use of expensive BGA components with fast & high quality of BGA re-balling process is a highly cost-effective process

Reballing BGAs contributes to sustainability by extending the lifecycle of electronic components. By reusing components, the demand...

Essemtec`s Latest Animal: Tarantula Underfill

An Innovative Solution to perform underfill process accurately, precisely & efficiently...

[Translate to Englisch:] Integrated PCB Inspection Essemtec

I2S Integrated Optical PCB Inspection - for Dispensing & Pick-and-Place processes

The inspection functionality is fully integrated in the ePlace production flow and acts as a process sequence...

Events

Essemtec to Showcase High-Speed Dispensing and SMT Solutions at Nepcon Shenzhen 2024

Discover Essemtec`s SMT Equipment - Pick and Place & Dispensing with Integrated Inspection System...

Electronica München 2024

Meet Essemtec and Nano Dimension in Booth B1.115 at electronica, Munich, November 12. - 15., 2024

Discover Essemtec’s All-in-One Concept for Rapid-Prototyping at Electronica 2024...

Essemtec invites you to TEK Day Poland I Amber Expo Gdańsk I 26. Sept 2024 I booth 87

Discover Essemtec`s SMT Equipment - Pick and Place & Dispensing with Integrated Inspection System...

Essemtec invites you to SMTA International I Rosemont, IL USA I 22.-24. Oct 2024 I booth 2841

Discover Essemtec`s SMT Equipment - Pick and Place & Dispensing with Integrated Inspection System...

Essemtec and SMD-TEC invite you to WoTS – World of Industry, Technology & Science I Jaarbeurs Utrecht, NL I Booth 9A092

Discover Essemtec`s SMT Equipment - Pick and Place & Dispensing with Integrated Inspection System...