Introducing - The Puma - State of the art technology. Expandable in any direction. Same as in nature our Puma is common modular and adaptive in all kinds of environment. With different modules the systems grow synchronously with the customer’s requirements for performance and processes. Puma is world`s best highspeed Pick-and-Place solution which can also be used in ultraflexible, rapid prototyping development.
Puma4 | Puma2 | Puma | ||
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Productivity | Optimum placement speed | 18’100 cph (4-axes) | 11’200 cph (2-axes) | 6’700 cph (1-axis) |
Optimum jetting speed | Valve performance 720’000 - System Ø 260’000 dots/h | |||
Feeder | Feeder capacity 8 mm Tape | 280 (160 inline) | 260 (140 inline) | 260 (140 inline) |
Components | Component size range | 008004 (imp.) - 109 x 87 mm | (Note specs for details) | |
Accuracy | Placement accuracy (x, y) | Chip ± 40 μm (3σ) / QFP ± 30 μm (3σ) | ||
PCB | Max. PCB dimensions | 560 x 610 mm (22 x 24“) optional 1’800 x 610 mm (71 x 24“) | ||
Dimensions | Machine footprint | 1’557 x 1’357 mm (61 x 53“) |
State of the art, full graphics, 21.5”, 16:9 HD wide touch screen, Windows 10 - 64 bit, fingertip operation,
universal CAD conversion, zoom at camera windows, all-in-one job planning, setup optimisation,
stock management, ERP/MES connection, data analysis, line management and more.
Innovative, future-oriented and renowned for top quality. ZIEHL, a manufacturer of electronic devices for modern, reliable measurement and control technology, has invested in four Essemtec Puma pick-and-place systems for its SMT production facility. The two Puma lines each offer 320 8 mm feeder places plus trays. Both lines and external programming stations are networked and connected to the ZIEHL ERP system.
An investment in an appropriate machine park is almost inevitable, even if this is not part of the company’s core business. Beflex Electronic GmbH identified this problem and has solved it for their customers: They offer a prototype production within five working days from order to delivery.
Piezo Jet | Dynamic Shockwave | Volume | Screw | Time-Pressure | |||
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SMD-Adhesives, Underfill, Silver Epoxy, UV-Adhesives, Globe Top, Encapsulation, Solder Paste | Solder Paste, SMD-Adhesives | Underfill, Gasketing, Globe Top, Dam and Fill, Solder Paste | Solder Paste, SMD-Adhesive, Globe Top, Encapsulation, Silver Epoxy, Dam and Fill | Gasketing, Globe Top, Encapsulation, Solder Paste, SMD-Adhesive, Silver Epoxy, Dam and Fill | |||
Low - High Viscosity | High Viscosity | Low - High Viscosity | High Viscosity | High Viscosity | |||
> 720’000 dots/h | Up to 720’000 dots/h | Up to 28.000 dots/h | Up to 20.000 dots/h | Up to 28.000 dots/h |
Since 1991, we have been evaluating and developing solutions for your electronics production in cooperation with you.
Due to their highly flexible design, the modular machine platforms are ideally suited for RFNS (Request For Non-Standard).
Our engineers assist you in the development of your production process, on request.
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Configurable heads with 1, 2 or 4 placement-axes. 2,5D and 3D dispensing and jetting, High resolution digital vision system with auto component teach-in and irregular ball recognition. Full operator support - Automated error analysis & KPI. Training, support and troubleshooting via advanced remote access. Investment protection; all options and heads retrofittable. Multi flexible feeder, multi lane cassette or highly accurate single lane feeder. Tape, Stick, Strip, Tray slider. Largest component spectrum; 008004 up to 109 x 87 mm, height up to 25 mm.