Smt Applications
realized on our machines
We are inspired by nature`s incredible adaptability! Demanding flexibility in modern SMT Productions has a wide range of daily challenges. Therefore our Equipment is widely adaptable. For some applications special machine attachments and optional features may be necessary. Contact us for further information.
SMD Pick-and-Place
SMD placement of various components in real-time.
PCB repair
Complex, efficient rework on populated boards.
BGA Reballing
Flux dispensing & solder balls reballing.
Printed Electronics
Electronic assembly on flexible substrates.
glue jetting
High-speed SMT glue jet dispensing of various dot sizes.
solder paste jetting
High-speed solder paste jet printing of various dot sizes.
component flipper
Component-Flipper-Module - Fox in a line configuration.
combined jetting
High-speed jetting of multiple fluids in one pass through.
chip underfill
Chip Underfill with different valve setups.
3D dispensing
3D contact dispensing with automatic laser adjustment.
dam and fill
High aspect ration dam and fill in one single pass through.
2.5D assembly
2.5D flexible SMT mounting for stacked assemblies.
substrate cavities
Dispensing and SMT assembly on molded lead frames.
silver epoxy
Jetting of various line widths and patterns with one setup.
led encapsulation
Jet process of LED packages with phosphor silicone.
3d gasketing
3D gasketing with Time-Pressure or Screw Valve.
led assembly
Learn more about Essemtec's LED assembly solutions.