Precise, Flexible
High Speed Dispensing
Introducing - our valve technologies - wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.
| Piezo Jet | Shockwave Jet | Volume | Screw | Time-Pressure | ||
|---|---|---|---|---|---|---|
| SMD-Adhesives, Underfill, Silver Epoxy, UV-Adhesives, Globe Top, Encapsulation, Dielectric Ink | Solder Paste, Liquid Metal | Underfill, Gasketing, Globe Top, Dam and Fill, Solder Paste | Solder Paste, SMD-Adhesive, Globe Top, Encapsulation, Silver Epoxy, Dam and Fill | Gasketing, Globe Top, Encapsulation, Solder Paste, SMD-Adhesive, Silver Epoxy, Dam and Fill | ||
| Low - High Viscosity | High Viscosity | Low - High Viscosity | High Viscosity | High Viscosity | ||
| Max Frequency: 2’000’000 dots/h BGA Jet-on-the-Fly: 780’000 dots/h BGA Stop & Jet: 177’000 dots/h | Max Frequency: 780’000 dots/h BGA Jet-on-the-Fly: 480’000 dots/h Average Speed: 280’000 dots/h | 26’000 dots/h (BGA Pattern*) | 30’000 dots/h (BGA Pattern*) | 38’000 dots/h (BGA Pattern*) |
* Full Speed, Dot size 0.5 mm, dot matrix 0.8 x 0.8 mm, 1000 dots, medium: Loctite 3621
Dispensing Valves
for all Applications
With up to three valves per machine, our dispensers open up a variety of possibilities.
Different dispensing technologies can thus be applied in one go, without further changeovers.
A user-friendly, flexible software controls all processes and displays them in real time.
Solder Paste Jet
PIEZO JET
Volume
Time-Pressure
Screw
| Description |
|---|
| High speed non-contact jetting |
| Dynamic shockwave jet technology |
| Free selectable and combinable settings |
| Integrated valve heating |
| Usable / Recommended applications |
|---|
| Solder paste jet printing, jetting in cavities |
| Description |
|---|
| High speed non-contact jetting |
| piezoelectric jet technology |
| Free selectable and combinable settings |
| Usable / Recommended applications |
|---|
| SMD-/UV-/AG-Adhesives, Underfil, Dam&Fill, |
| Encapsulation, LED, Grease, Oil, etc. |
| Optional |
|---|
| Level Control, Valve Heater |
| Description |
|---|
| Endless piston dosing principle |
| Self-sealing rotor/stator design |
| Special screw geometry allows endless dosing flow |
| Usable / Recommended applications |
|---|
| Sealing, Gasketing, Dam&Fill, Underfill, |
| Globe Top, Thermal Grease, etc. |
| Optional |
|---|
| Level Control, Needle Heater, Micron-S needle kit |
| Description |
|---|
| Controlled pressure pulse |
| Very robust, reliable valve |
| No maintenance, easy to clean |
| Usable / Recommended applications |
|---|
| SMD-/UV-Adhesives, AG-Adhesives, Dam&Fill, |
| Encapsulation, etc. |
| Optional |
|---|
| Level Control, Needle Heater, Micron-S needle kit |
| Description |
|---|
| High precision stainless steel screw |
| Encoder controlled motor |
| Screws: shallow, standard, deep, ultra deep |
| Usable / Recommended applications |
|---|
| Solder Paste, SMD-Adhesives, Silver-Epoxy, etc. |
| Optional |
|---|
| Level Control, Needle Heater, Micron-S needle kit |
Naturally adaptive
Conductive and non-conductive joining processes are seeing rapid growth in electronic manufacturing thanks to improvements in the formulation of fluids, pumps and modern dispensing equipment. These technologies open up a wealth of applications such as MEMS packaging, exact LED positioning, heavy component placement or power modules to name just a few. Our machines are easily integrated into high speed lines and highly complex dispense applications. Three processes at the same time. Plug and Play for valve change. Piezo Jet Valve - super high speed for low viscosity. Solder Jet, Volume Displacement, Time/Pressure, Archimedean Screw Valve.