Introducing - our valve technologies - wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.
Piezo Jet | Dynamic Shockwave | Volume | Screw | Time-Pressure | |||
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SMD-Adhesives, Underfill, Silver Epoxy, UV-Adhesives, Globe Top, Encapsulation, Solder Paste | Solder Paste, SMD-Adhesives | Underfill, Gasketing, Globe Top, Dam and Fill, Solder Paste | Solder Paste, SMD-Adhesive, Globe Top, Encapsulation, Silver Epoxy, Dam and Fill | Gasketing, Globe Top, Encapsulation, Solder Paste, SMD-Adhesive, Silver Epoxy, Dam and Fill | |||
Low - High Viscosity | High Viscosity | Low - High Viscosity | High Viscosity | High Viscosity | |||
> 720’000 dots/h | Up to 720’000 dots/h | Up to 28.000 dots/h | Up to 20.000 dots/h | Up to 28.000 dots/h |
With up to three valves per machine, our dispensers open up a variety of possibilities.
Different dispensing technologies can thus be applied in one go, without further changeovers.
A user-friendly, flexible software controls all processes and displays them in real time.
Description |
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High speed non-contact jetting |
Dynamic shockwave jet technology |
Free selectable and combinable settings |
Integrated valve heating |
Usable / Recommended applications |
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Solder paste jet printing, jetting in cavaties |
Description |
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High speed non-contact jetting |
piezoelectric jet technology |
Free selectable and combinable settings |
Usable / Recommended applications |
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SMD-/UV-/AG-Adhesives, Underfil, Dam&Fill, |
Encapsulation, LED, Grease, Oil, etc. |
Optional |
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Level Control, Valve Heater |
Description |
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Endless piston dosing principle |
Self-sealing rotor/stator design |
Special screw geometry allows endless dosing flow |
Usable / Recommended applications |
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Sealing, Gasketing, Dam&Fill, Underfill, |
Globe Top, Thermal Grease, etc. |
Optional |
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Level Control, Needle Heater, Micron-S needle kit |
Description |
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Controlled pressure pulse |
Very robust, reliable valve |
No maintenance, easy to clean |
Usable / Recommended applications |
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SMD-/UV-Adhesives, AG-Adhesives, Dam&Fill, |
Encapsulation, etc. |
Optional |
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Level Control, Needle Heater, Micron-S needle kit |
Description |
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High precision stainless steel screw |
Encoder controlled motor |
Screws: shallow, standard, deep, ultra deep |
Usable / Recommended applications |
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Solder Paste, SMD-Adhesives, Silver-Epoxy, etc. |
Optional |
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Level Control, Needle Heater, Micron-S needle kit |
Conductive and non-conductive joining processes are seeing rapid growth in electronic manufacturing thanks to improvements in the formulation of fluids, pumps and modern dispensing equipment. These technologies open up a wealth of applications such as MEMS packaging, exact LED positioning, heavy component placement or power modules to name just a few. Our machines are easily integrated into high speed lines and highly complex dispense applications. Three processes at the same time. Plug and Play for valve change. Piezo Jet Valve - super high speed for low viscosity. Solder Jet, Volume Displacement, Time/Pressure, Archimedean Screw Valve.