Unlock the Future of SMT with Essemtec's Latest Upgrade: PCIe5 Controller and .NET Core Architecture


Essemtec's commitment to continuous improvement means that every upgrade enhances the value of your equipment...


Essemtec Machine Upgrade Dispensing Pick and Place

At Essemtec, continuous improvement is more than a philosophy - it’s a commitment to ensuring our customers always have access to the best in class. With the approaching obsolescence of Windows 10 and the limitations of current controller processing power, now is the time to upgrade.

The latest upgrade featuring the new PCIe5 controller and .NET Core architecture offers a leap forward in performance, security, and future-proofing. This upgrade brings immediate performance improvements to dispensing equipment, while upgrades for Pick & Place machines will be available in the first part of 2025 - ensuring your investment remains competitive and cutting-edge.

Future-Proof Security and Support

With Windows 10 support ending in 2025, upgrading to Windows 11 ensures your Essemtec machines stay secure and supported well into the future. This update not only optimizes your machine's performance but also extends its lifespan by ensuring compatibility with future innovations.

Enhanced Performance: Dispensing at New Heights
The integration of ePlace 50 software is a game-changer for dispensing applications:

  • Jet-on-the-Fly Solder Paste Jetting: Performance has increased by an impressive 45%, reaching an average speed of 260,000 dots per hour (dph), and up to 480,000 dph on BGA patterns. Jet-on-the-Fly requires a dedicated license.
  • Traditional Stop & Jet Solder Paste Jetting performance are as well improved by 15 to 20%.
  • Improved Dispensing Across Valves: Tests with Loctite Glue have demonstrated speed gains of 10% to 50%, with the highest improvements observed when using VTP or VSR valves.


Streamlined Retrofit for Maximum Value

This upgrade offers a straightforward retrofit option. Existing Essemtec machines can be upgraded to run on Windows 11, allowing you to enjoy the benefits of enhanced performance and security without the need for entirely new equipment. The installation of the new controller can be scheduled during a regular maintenance visit or coordinated with the Service Team to minimize downtime.

Falcon Software

New Features with the Latest Software Release
The latest software release introduces advanced features that further enhance productivity and accuracy:

Hermes 1.6 Protocol

  • Improved Line Efficiency: Hermes 1.6 optimizes workflow by synchronizing processes, reducing idle time, and minimizing errors.
  • Version 1.6 Enhancements: Version 1.6 includes updates like enhanced board information transmission (SendBoardInfo) and capabilities that allow equipment to be queried for its Hermes-specific features, making it easier for manufacturers to integrate and optimize equipment from different vendors.
  • Enhanced Traceability: By ensuring full component tracking throughout the production process, Hermes 1.6 improves traceability, enabling better quality assurance and compliance with industry standards.

 

I2S Integration for Assembly Lines
After successfully launching the I2S system for dispensing inspection and component placement inspection on standalone machines, the system is now compatible with Essemtec machines placed in an assembly line configuration:

  • Comprehensive Inspection Capability: I2S enables inspection at multiple stages of the process, integrating seamlessly with various equipment for enhanced quality control.
  • Enhanced Process Visibility: Real-time data monitoring ensures immediate feedback and corrective action, improving yield and reducing defects.


Updated MFOV (Multi-Field of View) Software
The latest version of MFOV, delivers significant advancements in component recognition and alignment.

  • Advanced Component Recognition: Enhanced algorithms improve alignment and placement accuracy, even for large components.
  • Expanded Inspection Capability: Pick & Place machines can now inspect larger components before placement, ensuring high precision and quality even with very large components.
  • Please see components size our Pick & Place equipment are able to handle with the latest version of software and improvement:
  • Overall: 008004 imp (0201 mm) - 109 x 87 mm
    - 008004 imp (0201 mm) – 37.5 x 37.5 mm on std. bottom cam
    - Up to 87 x 35 mm incl. Leads on std. bottom cam with MFOV license
    - Up to 109 x 87 mm incl. leads on MFOV box


Continuous Improvement: Your Competitive Edge

Essemtec's commitment to continuous improvement means that every upgrade enhances the value of your equipment. The combination of PCIe5 hardware, .NET Core software, and ePlace 50 ensures that your production operations remain fast, accurate, and reliable - well beyond the industry standard.

Solder Paste Jetting Upgrade

Upgrade Today for Unmatched Performance

Take the next step in improving your production with Essemtec’s latest technology. Contact us or your local essemtec partner (here) today to learn more about how this upgrade can elevate your operations and keep you ahead in the fast-paced world of SMT manufacturing.

essemtec.dispatch@nano-di.com
essemtec.service@nano-di.com
essemtec.service-usa@nano-di.com

Our Focus - Your Solution.

New Machines shipped from September 2024 have been equipped with new PCeI5 controller and the .NET Core software architecture.

 

Strengthening Partnerships in China with Juntao Dr. Power

Together with Intellengine, we remain fully committed to delivering cutting-edge technology and reliable support that grows with our customers...

Essemtec Takes Home 2025 EM Innovation Award for Game-Changing Spider 2025 with Jet-on-the-Fly for High Speed Solder Paste Jetting and Dispensing

Receiving the 2025 EM Innovation Award for our Spider 2025 is a tremendous honor and a reflection of our commitment...

Essemtec Technology Day at Achat Engineering GmbH - 22.05.2025 - Lengede, Germany

Hands-on applications for the electronics manufacturing of the future...

Essemtec invites you to Elektronikmässan, Kistamässan Sweden, 02. - 03. April 2025, Booth M46

Discover Essemtec`s SMT Equipment - Pick and Place & Dispensing with Integrated Inspection System...

Essemtec introduces new machine models enhancing pick-and-place speed with FOX Ultra and PUMA Ultra

For manufacturers requiring high-precision dispensing capabilities, the FOX Ultra and PUMA Ultra are also available as All-in-One variants...

Essemtec strengthens its demo center in Munich with the latest innovations

Essemtec, market leader in adaptive SMT solutions for electronics manufacturing, is expanding its demo center in Munich!

Pro-Active Engineering: Enhancing Efficiency and Precision with Essemtec’s FOX All-in-One

Essemtec`s engineering team is highly responsive and knowledgeable, providing tailored support to address our specific needs...

Eurecat and Essemtec: Advancing Innovation in Functional Printing and Printed Electronics

To maintain their leadership in functional printing and printed electronics, Eurecat has relied on Essemtec’s PUMA All-in-One system...

How EFB GmbH Enhances Electronic Production with Essemtec’s Puma All-in-One

Remaining well-equipped to tackle new challenges and maintain its legacy of excellence in electronic manufacturing....

Essemtec Expands Presence in Mexico with New Office in Guadalajara

With this expansion, Essemtec continues to focus on delivering innovative solutions and exceptional customer support in Mexico...

Essemtec and PBT Rosnov invite you at AMPER Show Brno, Czech Republic, 18. - 20. March 2025, Booth F - 3.02

Discover Essemtec`s SMT Equipment - Pick and Place & Dispensing with Integrated Inspection System...

Essemtec invites you at IPC APEX Expo, Anaheim USA, 15. - 20. March 2025 in Booth 2148

Discover Essemtec`s SMT Equipment - Pick and Place & Dispensing with Integrated Inspection System...