Nano Dimension and Essemtec are changing the way the world manufactures. The ability to design, produce and test new types of 3D PCBs in days enables a massive reduction in development costs. Combining an additively manufactured PCB with solder paste jetting and SMT pick and place workflow allows to reinvent electronics design and production.
Video – 3D PCB Production
Video – 3D NFC Coin Production
For more information:
https://www.nano-di.com/electronics
https://essemtec.com/en/products/
https://www.j-ames.com
![[Translate to Englisch:] Fox Pick and place solder paste jetting](/fileadmin/user_upload/news/2022/12-Dec/Essemtec-Fox-NFC-coin-production.jpg)
![[Translate to Englisch:] Fox PCB production](/fileadmin/user_upload/news/2022/12-Dec/Essemtec-Fox-PCB-production.jpg)
![[Translate to Englisch:] solder paste jetting and SMD placement](/fileadmin/user_upload/news/2022/12-Dec/Essemtec-Fox-Solder-Paste-Jetting.jpg)
![[Translate to Englisch:] SMT solder paste jetting](/fileadmin/user_upload/news/2022/12-Dec/Essemtec-NFC-Solder-Paste-Jetting.jpg)
