Essemtec to Showcase High-Speed Dispensing and SMT Solutions at Nepcon Shenzhen 2024

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Discover Essemtec`s SMT Equipment - Pick and Place & Dispensing with Integrated Inspection System...

Essemtec @ Nepcon Shenzhen 2024

Essemtec will be participating at Nepcon Shenzhen from November 6 to 8, 2024, at the Shenzhen World Exhibition & Convention Center (Baoan), Booth 9G50, alongside local partners SF-SMT and DKSH.

We will present our latest innovations, including the FOX All-in-One, PUMA All-in-One, and the new SPIDER 2025, which integrates our Jet-on-the-Fly technology. This groundbreaking technology enables high-speed, non-contact solder paste jetting, achieving faster production speeds and unmatched precision for fine pitch applications.

To learn more about the show, visit Nepcon Asia.

To book an appointment or demo, please contact Klaus Salmhofer, Director APAC, at klaus.salmhofer@nano-di.com.

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