At the recent Elexcon 2024 in Shenzhen, August 27-29, one of our Chinese partners, SF-SMT, presented Essemtec's cutting-edge FOX All-in-One platform, equipped with the Jet-on-the-Fly high-speed solder paste jetting solution. The FOX All-in-One, known for its compact design and versatility, was a key highlight, demonstrating its ability to deliver precise and efficient SMT assembly in space-constrained environments.
Elexcon, one of the premier electronics and technology trade shows in China, attracts a global audience of industry professionals, showcasing the latest innovations in electronics design, manufacturing, and IoT technologies. With its focus on advancing the electronics industry, it was the perfect platform to demonstrate the speed, accuracy, and flexibility of Essemtec’s solutions.
The Jet-on-the-Fly technology further impressed visitors with its high speed and accuracy, allowing for fine-pitch solder paste applications and small dots below 5 nanoliters. This innovative solution could work in complement to, or even eliminate, the need for traditional screen printing, providing manufacturers with greater flexibility and productivity in their SMT processes. The FOX All-in-One's capabilities of dispensing and placing in cavities or at different Z-levels were very well received and generated a lot of interest.
SF-SMT's participation at Elexcon underscores the growing demand for advanced SMT solutions in the Chinese market. Together, we continue to provide high-performance solutions that meet the evolving needs of modern electronics manufacturing.
