Already curious? Have you already planned your trip to Munich? From November 12th to 15th, Hall A3 is the place to be - and you will be right in the middle!
At booth 218 the Essemtec team is looking forward to show you the further developments of the dispensing and assembly platforms. The following topics await you at Essemtec:
- Exciting insights into the subject of solder paste jetting and data import via Gerber Files as part of an "all in one" application on our platforms
- Demo Line-production
- Standard Technologies and Competences Essemtec
- Vertical and horizontal integrations for industry 4.0 (MES connections such as ITAC, OIC, SAP, SECS/GEM, HERMES)
Let us surprise and inspire you. At our stand you will receive answers to the topics that exercise you the most - our experts are already looking forward to your visit!
Here you will find our invitation video - have fun!
We are looking forward to an intensive exchange and exciting discussions with you.
Order your free admission tickets today!